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Name | Categories | Stock | Book Now |
|---|---|---|---|
WINBOND | 50100 | ||
WINBOND | 9600 | ||
WINBOND | 2000 | ||
WINBOND | 27000 | ||
WINBOND | 200000 | ||
Qualcomm | 100 | ||
Qualcomm | 8000 | ||
Vishay | 600 | ||
Vishay | 23500 | ||
WEEN | 10000 | ||
Vishay | 14000 | ||
Vishay | 35000 | ||
Vishay | 4000 | ||
Vishay | 4000 | ||
Vishay | 2000 | ||
Vishay | 28000 | ||
Vishay | 23000 | ||
Vishay | 4000 | ||
Vishay | 13500 | ||
Vishay | 21000 | ||
Vishay | 21000 | ||
Epson | 4000 | ||
Epson | 8000 | ||
Epson | 10000 | ||
Epson | 135000 | ||
Infineon | 287 | ||
Yageo | 10000 | ||
Yageo | 45000 | ||
Yageo | 15000 | ||
Yageo | 40000 | ||
Vishay | 48000 | ||
VITROHM | 20000 | ||
DIODES | 6000 | ||
DIODES | 2000 | ||
DIODES | 12000 | ||
DIODES | 42000 | ||
DIODES | 24000 | ||
DIODES | 213000 | ||
ADI | 45 | ||
MICROCHIP | 40 | ||
RENASAS | 20 | ||
MICROCHIP | 20 | ||
RENASAS | 30 | ||
TI | 57 | ||
ADI | 36 | ||
NXP | 200 | ||
Nexperia | 360 | ||
ONSEMI | 36 | ||
0402 ⋅ 50V ⋅ 806ohm ⋅ RES ⋅ SMD ⋅ THICK FILM | 735 | ||
COPPER BERYLLIUM ⋅ EMI CONTACT FINGER ⋅ TH | 701 | ||
0603 ⋅ 25V ⋅ 470pF ⋅ CAP ⋅ CERAMIC ⋅ SMD ⋅ X7R | 565 | ||
0603 ⋅ 13.3kohm ⋅ 75 ⋅ RES ⋅ SMD ⋅ THICK FILM | 552 | ||
100V Vrrm ⋅ DIODE RECTIFIER ⋅ SMD ⋅ SOD123 | 435 | ||
0402 ⋅ 50V ⋅ 750ohm ⋅ RES ⋅ SMD ⋅ THICK FILM | 352 | ||
1mH ⋅ 6X9.2 ⋅ COMMON MODE CHOKE ⋅ IND ⋅ SMD | 304 |